Intel® Stratix® 10 GX FPGA
อุปกรณ์ Intel® Stratix® 10 GX ที่ประกอบด้วยถึง 10.2 ล้าน LEs They also feature up to 96 general purpose transceivers on separate transceiver tiles, and 2666 Mbps DDR4 external memory interface performance. The transceivers are capable of up to 28.3 Gbps short reach and across the backplane. These devices are optimized for FPGA applications that require the highest transceiver bandwidth and core fabric performance.
Intel® Stratix® 10 GX FPGA
เอฟพีจีเอ Intel® Stratix® 10 GX
เรียนรู้เพิ่มเติมเกี่ยวกับรูปแบบของอุปกรณ์ทั้งหมดและเปรียบเทียบข้อกำหนดเฉพาะ
คุณลักษณะและประโยชน์
เอฟพีจีเอ Intel® แรกที่ทำงานบนสถาปัตยกรรมเอฟพีจีเอ Hyperflex™
สถาปัตยกรรมเอฟพีจีเอ Intel® Hyperflex™ แนะนำรีจิสเตอร์ที่สามารถ bypass ได้ทุกที่ผ่านแฟบริกเอฟพีจีเอ These additional registers, called Hyper-Registers, are available on every interconnect routing segment and at the inputs of all functional blocks. Hyper-Registers enable three key design techniques to achieve the 2X core performance increase: Hyper-Retiming to eliminate critical paths, Hyper-Pipelining to eliminate routing delays, and Hyper-Optimization to achieve the best performance.
Enabling Next-Generation Chiplets Using Intel’s 3D System-in-Package Technology
The patented Embedded Multi-Die Interconnect Bridge (EMIB) technology provides a simple integration flow and offers an ultra-high density interconnect between heterogeneous die in the same package. It also enables in-package functionality that was either too complex or too cost prohibitive to implement with alternative in-package integration solutions.
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