Redefining the FinFET
After years of refining the FinFET platform, we redefined it to deliver an unprecedented level of performance uplift with our new SuperFin technology.
SuperFin leverages a combination of innovations across the entire process stack, from the transistor channel to the top metal layers. A key breakthrough is a new Super MIM capacitor, which delivers a 5x increase in capacitance within the same footprint as industry standard approaches. This industry-first technology drives a voltage reduction that in combination with all of these innovations enabled nearly the equivalent performance of a full-node transition.
Today, we are continuing to evolve our roadmap to one that showcases new levels of innovation and moving to an accelerated pace to enable an annual cadence of process improvements.
With our new Intel 4 and Intel 3 technologies, we are fully embracing EUV lithography, which involves a highly complex optical system of lenses and mirrors that focuses a 13.5 nm wavelength of light to print incredibly small features on silicon. This is a vast improvement over prior technology that used light at a wavelength of 193nm.
And with Intel 20A, we are ushering in the angstrom era by introducing two new breakthrough technologies, PowerVia and RibbonFET. PowerVia is Intel’s unique, industry-first implementation of backside power delivery. RibbonFET, Intel’s implementation of a Gate All Around transistor, is the company’s first new transistor architecture since it pioneered FinFETs in 2011.
What’s in a Name?
Intel has realigned its process naming to provide a more accurate view of process nodes across the industry and to better reflect the balance of power-efficiency, performance, and area in future nodes. For decades, the process “node” name corresponded to the actual length of certain physical transistor features. While the industry departed from that practice many years ago, it has continued to use this historical pattern of assigning node names using decreasing numbers that evoke units of dimension, such as nanometers. Intel is refreshing its lexicon to create a clear and meaningful framework to help customers have a more accurate view of process nodes across the industry to make better-informed decisions.