Speed time to market with three Intel® SDM reference designs for next-generation commercial All-in-One displays and visual IoT devices. The modules do not come with any enclosure or chassis, as they are meant to be integrated into a display or host system.
Together with the reference designs, Intel provides a peripheral interface board (PIB) that serves as a custom receptacle board for the Intel® SDM modules and can be used for testing the SDM platforms without the need of an SDM display or host system.
In addition, samples are available for evaluation. Interested ODMs can also access reference design files with a signed RDLA. See the specifications below, and talk to your Intel representative for more information.
Intel® SDM Reference Design Summary
The Intel® SDM–L specification has module dimensions of 175 mm x 100 mm and a thickness of not more than 20 mm.
The Intel® SDM–S specification is just a little bigger than a credit card—with module dimensions of 60 mm x 100 mm and a thickness of not more than 20 mm.