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移动式英特尔® HM70 高速芯片组

移动式英特尔® HM70 高速芯片组是英特尔将在 2013 年为奔腾® 和赛扬® 处理器推出的新芯片组之一。

移动式英特尔® UM77 高速芯片组

移动式英特尔® UM77 高速芯片组支持第二代和第三代智能英特尔® 酷睿™ 处理器家族,并提供 USB 3.0 功能。

英特尔® Q77 高速芯片组

英特尔® Q77 高速芯片组和第三代智能英特尔® 酷睿™ 博锐™ 处理器平台提供改进的可管理性和安全性。

2006 Intel Annual Report

Report details Intel's 2006 year financials and successes.

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Intel® Communications Technology

Intel communications based on Intel® architecture enhance the future of communications today.

Intel® DK100 Series Development Kit

Quickly develop, prototype, and deploy intelligent gateways that meet emerging IoT market requirements.

Chipset Intel® HM76 Express para portáteis

O chipset Intel® HM76 Express para portáteis é compatível com as famílias de processadores Intel® Core™ de segunda e terceira gerações e oferece a funcionalidade de USB 3.0.

Chipset Intel® Z77 Express

Proporcionando overclocking para ajuste de precisão, o chipset Intel® Z77 Express adiciona velocidades de frequência e resposta de PC para inicializações do sistema e abertura de aplicativos.

Chipset Intel® Q77 Express

O chipset Intel® Q77 Express e a 3ª geração da plataforma de processadores Intel® Core™ vPro™ oferecem gerenciabilidade e segurança aprimoradas.

Intel® Atom™ SoC E3800-I-based Platform: Schematic Checklist

Checklist: Provides Intel® Atom™ SoC E3800-I-based platform design recommendations and guidance on memory, interfaces, and more. (v.2, Oct. 2013)