Intel® eASIC™ N3X devices are manufactured on a 28nm process and Intel® eASIC™ N2XT devices are manufactured on a 45nm process. Intel® eASIC™ devices provide fast time-to-deployment of logic, DSP, or IO dominated custom devices.
|
N2XLT190 (45nm) |
N3XT500 (28nm) |
|---|---|---|
eCells |
184,320 |
503,424 |
eDFFs |
122,880 |
346,104 |
Full Adders |
|
503,424 |
bRAM Kbits |
5,161 |
15,409 |
bRAM blocks |
140 |
1,672 |
PLL |
8 |
16 |
DLL |
22 |
42 |
MGIO-T |
8 (5.0Gbps) |
18 (12.5Gbps) |
|
||
CS160 (7x11mm) |
|
4/30 |
| FC484 (23mm) | 2/484 |
8/316 |
FC672 (27mm) |
8/372 |
8/316 |
FC780 (29mm) |
|
14/336 |
FC896 (31mm) |
|
18/336 |
FC1152 (35mm) |
|
18/392 |