Intel® Socket Test Technology for the LGA775 Socket
The Intel® Socket Test Technology for the LGA775 socket is a test chip that enables testing for the mechanical integrity and electrical continuity of both socket-to-board solder ball connectivity and socket-to-CPU contact connectivity. Once inserted into the boards LGA775 socket, the test chip works with either in-circuit testers (ICT) or manufacturing defect analyzers (MDA) that have access to
all the socket nets through test fixture probes.
An ICT uses digital test vectors which execute very quickly when power is applied to the board typically less than a couple of milliseconds depending upon test head capability. An MDA doesn’t power the board, but uses its analog measurement capability. Test time using an MDA is typically longer.
Read the full Intel® Socket Test Technology for the LGA775 Socket Application Note.