® ® Dual-Core Intel Xeon Processor 7000 Sequence Thermal/Mechanical Design Guidelines
November 2005
Document Number: 309625-001
®
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® ®
Dual-Core Intel Xeon Processor 7000 Sequence Thermal /Mechanical Guidelines
Contents
1
2
A B C
D
Introduction.........................................................................................................................7 1.1 Objective ...............................................................................................................7
1.2 Scope ....................................................................................................................7
1.3 References............................................................................................................7
1.4 Definition of Terms ................................................................................................8
Thermal Mechanical Design.............................................................................................11
2.1 Mechanical Requirements...................................................................................11
2.1.1 Processor Mechanical Parameters ........................................................11
2.1.2 Mechanical Dimensions .........................................................................12
2.1.3 Mechanical Considerations ....................................................................14
2.2 Processor Thermal Parameters and Features ....................................................15
2.2.1 Thermal Control Circuit and TDP ...........................................................15
2.2.2 Dual Core Special Considerations .........................................................16
2.2.3 Thermal Profile .......................................................................................18
2.2.4 TCONTROL Definition............................................................................20
2.2.5 Performance Targets..............................................................................21
2.3 Characterizing Cooling Solution Performance Requirements .............................22
2.3.1 Fan Speed Control .................................................................................22
2.3.2 Processor Thermal Characterization Parameter
Relationships..........................................................................................23
2.3.3 Chassis Thermal Design Considerations ...............................................25
2.4 Thermal/Mechanical Reference Design Considerations .....................................26
2.4.1 Heatsink Solutions..................................................................................26
2.4.2 Thermal Interface Material .....................................................................26
2.4.3 Summary................................................................................................27
2.4.4 Assembly Overview of the Intel Reference Thermal
Mechanical Design .................................................................................27
2.4.5 Thermal Solution Performance Characteristics......................................29
2.4.6 Thermal Profile Adherence.....................................................................31
2.4.7 Components Overview ...........................................................................32
Mechanical Drawings .......................................................................................................35
Safety Requirements........................................................................................................49
Quality and Reliability Requirements ...............................................................................51
C.1 Intel Verification Criteria for the Reference Designs ...........................................51
C.1.1 Reference Heatsink Thermal Verification...............................................51
C.1.2 Environmental Reliability Testing ...........................................................51
C.1.3 Material and Recycling Requirements....................................................53
Supplier Information .........................................................................................................55
D.1 Intel Enabled Suppliers .......................................................................................55
® ®
Dual-Core Intel Xeon Processor 7000 Sequence Thermal /Mechanical Guidelines
3
Figures 2-1
2-2
2-3 2-4 2-5 2-6 2-7 2-8 2-9 2-10 2-11 2-12
2-13 2-14 2-15 A-1 A-2 A-3 A-4 A-5 A-6 A-7 A-8 A-9 A-10 A-11 A-12 A-13 C-1 C-2
Dual-Core Intel® Xeon® Processor 7000 Sequence
Mechanical Drawing, Sheet 1 .............................................................................12
Dual-Core Intel® Xeon® Processor 7000 Sequence
Mechanical Drawing, Sheet 2 .............................................................................13
Dual Core vs. Dual Die........................................................................................16
Fan Speed Control Dual Core.............................................................................17
Thermal Profile Diagram ..................................................................................... 19
TCONTROL and Thermal Profile Interaction ...................................................... 20
Thermal Profile for the Dual-Core Intel® Xeon® Processor 7000 Sequence .....21
TCONTROL and Fan Speed Control ..................................................................22
Processor Thermal Characterization Parameter Relationships ..........................24
Exploded View of CEK Thermal Solution Components ......................................28
2U+ CEK Heatsink Thermal
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Dual-Core Intel Xeon
Processor 7000 Sequence
Thermal/Mechanical Design Guidelines.