® Intel X58 Express Chipset
Thermal and Mechanical Design Guide
November 2009
Document Number: 320840-003
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Thermal and Mechanical Design Guide
Contents
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5
A B C
Introduction ..............................................................................................................7
1.1 Design Flow........................................................................................................7
1.2 Definition of Terms..............................................................................................8
1.3 Reference Documents ..........................................................................................8
Packaging Technology ...............................................................................................9
2.1 Non-Critical to Function Solder Joints ................................................................... 11
2.2 Package Mechanical Requirements....................................................................... 12
Thermal Specifications ............................................................................................ 13
3.1 Thermal Design Power (TDP) .............................................................................. 13
3.2 Case Temperature............................................................................................. 13
Thermal Metrology .................................................................................................. 15
4.1 Die Temperature Measurements.......................................................................... 15
4.1.1 Zero Degree Angle Attach Methodology ..................................................... 15
4.2 Airflow Characterization ..................................................................................... 17
ATX Reference Thermal Solution.............................................................................. 19
5.1 Operating Environment ...................................................................................... 19
5.2 Board-Level Components Keepout Dimensions ...................................................... 22
5.3 Reference Heatsink Thermal Solution Assembly..................................................... 23
5.4 Mechanical Design Envelope ............................................................................... 23
5.4.1 Extruded Heatsink Profiles....................................................................... 23
5.4.2 Heatsink Orientation............................................................................... 23
5.4.3 Thermal Interface Material....................................................................... 23
5.4.4 Heatsink Clip ......................................................................................... 24
5.4.5 Anchor.................................................................................................. 24
5.5 Reliability Guidelines.......................................................................................... 25
5.6 Alternate Heatsink Thermal Solution Assembly ...................................................... 25
5.7 Alternate Heatsink Mechanical Design Envelope..................................................... 27
5.7.1 Extruded Heatsink Profiles....................................................................... 27
5.7.2 Heatsink Clip ......................................................................................... 27
5.7.3 Anchor.................................................................................................. 28
5.7.4 Ramp Retainer....................................................................................... 28
5.7.5 Thermal Interface Material....................................................................... 28
Thermal Solution Component Suppliers ................................................................... 29
Mechanical Drawings for Package & Reference Thermal Solution ............................ 31
Mechanical Drawings for Alternate Thermal Solution............................................... 35
Thermal and Mechanical Design Guide
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Figures 1-1 Thermal Design Process ............................................................................................. 7
2-1 IOH Package Dimensions (Top View)............................................................................ 9
2-2 IOH Package Dimensions (Side View)........................................................................... 9
2-3 IOH Package Dimensions (Bottom View)......................................................................10
2-4 Non-Critical to Function Solder Joints ..........................................................................11
4-1 Thermal Solution Decision Flow Chart..........................................................................16
4-2 Zero Degree Angle Attach Heatsink Modifications..........................................................16
4-3 Zero Degree Angle Attach Methodology (Top View) .......................................................17
4-4 Airflow and Temperature Measurement Locations..........................................................17
5-1 ATX Boundary Conditions ..........................................................................................20
5-2 Side View of ATX Boundary Conditions ........................................................................21
5-3 Heatsink Board Component Keepout ...........................................................................22
5-4 Reference Heatsink Assembly.....................................................................................23
5-5 Alternate Heatsink Assembly......................................................................................25
5-6 Retention Mechanism Component Keepout Zones for Alternate Heatsink ..........................26
5-7 Retention Mechanism Component Keepout Zones for Alternate Heatsink ..........................27
B-1 IOH
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