mPGA604 Socket Mechanical Design Guide March 2005 Document Number: 254239-002 ® INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS PROVIDED IN INTEL'S TERMS AND CONDITIONS OF SALE FOR SUCH PRODUCTS, INTEL ...ASSUMES NO LIABILITY WHATSOEVER, AND INTEL DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY, RELATING TO SALE AND/OR USE OF INTEL PRODUCTS INCLUDING LIABILITY OR WARRANTIES RELATING TO FITNESS FOR A PARTICULAR PURPOSE, MERCHANTABILITY, OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. Intel products are not intended for use in medical, life saving, life sustaining applications. Intel may make changes to specifications and product descriptions at any time, without notice. Designers must not rely on the absence or characteristics of any features or instructions marked "reserved" or "undefined." Intel reserves these for future definition and shall have no responsibility whatsoever for conflicts or incompatibilities arising from future changes to them. The mPGA604 socket may contain design defects or errors known as errata, which may cause the product to deviate from published specifications. Current characterized errata are available on request. Contact your local Intel sales office or your distributor to obtain the latest specifications and before placing your product order. Copies of documents, which have an order number and are referenced in this document, or other Intel literature, may be obtained by calling 1-800-548- 4725, or by visiting Intel's Web Site. Intel is a trademark or registered trademark of Intel Corporation or its subsidiaries in the United States and other countries. Copyright © 2003-2005, Intel Corporation. All rights reserved. * Other brands and names may be claimed as the property of others. 2 mPGA604 Socket Mechanical Design Guide Contents 1 Introduction ....................................................................................................................... 7 1.1 Objective ................................................................................................................7 1.2 Purpose..................................................................................................................7 1.3 Scope .....................................................................................................................7 2 Assembled Component and Package Description........................................................ 9 3 Mechanical Requirements.............................................................................................. 11 3.1 Attachment...........................................................................................................11 3.2 Materials...............................................................................................................11 3.2.1 Socket Housing....................................................................................... 11 3.2.2 Color........................................................................................................ 11 3.3 Cutouts for Package Removal .............................................................................11 3.4 Socket Standoffs Height ......................................................................................11 3.5 Markings...............................................................................................................12 3.5.1 Name....................................................................................................... 12 3.5.2 Lock (Closed) and Unlock (Open) Markings........................................... 12 3.5.3 Lot Traceability........................................................................................ 12 3.6 Socket Size ..........................................................................................................12 3.7 Socket/Package Translation During Actuation ....................................................13 3.8 Orientation in Packaging, Shipping and Handling ...............................................13 3.9 Contact Characteristics........................................................................................13 3.9.1 Number of contacts................................................................................. 13 3.9.2 Base Material .......................................................................................... 13 3.9.3 Contact Area Plating ............................................................................... 13 3.9.4 Solder Ball Attachment Area Plating....................................................... 13 3.9.5 Solder Ball Characteristics...................................................................... 13 3.9.6 Lubricants................................................................................................ 13 3.10 Material and Recycling Requirements .................................................................13 3.11 Lever Actuation Requirements.............................................................................14 3.12 Socket Engagement/Disengagement Force ........................................................14 3.13 Visual Aids ...........................................................................................................14 3.14 Socket BGA Co-Planarity.....................................................................................14 3.15 Solder Ball True Position .....................................................................................14 3.16 Critical-to-Function Dimensions...........................................................................14 4 Electrical Requirements ................................................................................................. 17 4.1 Electrical Resistance............................................................................................18 4.2 Determination of Maximum Electrical Resistance ...............................................22 4.3 Inductance............................................................................................................23 4.3.1 Design Procedure for Inductance Measurements .................................. 24 4.3.2 Correlation of Measurement and Model Data Inductance ...................... 25 4.4 Pin-to-Pin Capacitance ........................................................................................25 4.5 Dielectric Withstand Voltage................................................................................25 4.6 Insulation Resistance...........................................................................................25 4.7 Contact Current Rating ........................................................................................25 5 Environmental Requirements ........................................................................................ 27 5.1 Mixed Flowing Read the full R.

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