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® Intel I/O Controller Hub 8 (ICH8) Family Thermal and Mechanical Design Guidelines ® — For the Intel I/O Controller Hub 8 (ICH8) Desktop Family. June 2006 Document Number: 313058-001 THIS DOCUMENT AND RELATED MATERIALS AND INFORMATION ARE PROVIDED "AS IS” WITH NO WARRANTIES, EXPRESS OR IMPLIED, INCLUDING BUT NOT LIMITED TO ANY IMPLIED WARRANTY OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE, NON-INFRINGEMENT OF INTELLECTUAL PROPERTY RIGHTS, OR ANY WARRANTY OTHERWISE ARISING OUT OF ANY PROPOSAL, SPECIFICATION, OR SAMPLE. INTEL ASSUMES NO RESPONSIBILITY FOR ANY ERRORS CONTAINED IN THIS DOCUMENT AND HAS NO LIABILITIES OR OBLIGATIONS FOR ANY DAMAGES ARISING FROM OR IN CONNECTION WITH THE USE OF THIS DOCUMENT. Intel products are not intended for use in medical, life saving, life sustaining, critical control or safety systems, or in nuclear facility applications. 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Intel, Pentium, and the Intel logo are trademarks or registered trademarks of Intel Corporation or its subsidiaries in the United States and other countries. *Other names and brands may be claimed as the property of others. Copyright © 2006 Intel Corporation. All rights reserved. 2 Thermal and Mechanical Design Guidelines Contents 1 2 3 4 Appendix A Appendix B Introduction..........................................................................................................................7 1.1 Terminology ............................................................................................................7 1.2 Reference Documents............................................................................................8 Product Specifications.........................................................................................................9 2.1 Package Description...............................................................................................9 2.2 Package Loading Specifications.............................................................................9 2.3 Thermal Specifications ...........................................................................................9 2.4 Power Specifications ............................................................................................11 Thermal Metrology.............................................................................................................13 3.1 Case Temperature Measurements.......................................................................13 3.2 0° Angle Thermocouple Attach Methodology .......................................................13 3.3 Ambient Temperature and Airflow Measurement.................................................14 Reference Thermal Solution..............................................................................................17 4.1 Environmental Reliability Requirements...............................................................17 Enabled Suppliers .............................................................................................................19 Mechanical Drawings ........................................................................................................21 Thermal and Mechanical Design Guidelines 3 Figures Figure 1. 0° Angle Attach Methodology (top view, not to scale) .......................................14 Figure 2. 0° Angle Attach Heatsink Modifications (generic heatsink shown, not to scale)14 Figure 3. Recommended Temperature Measurement Placement: Top View ..................15 Figure 4. Recommended Airflow and Temperature Placement: Side View......................15 ® Figure 8. Intel ICH8 Component Package Drawing ........................................................22 Figure 9. Motherboard Keep-Out for Reference Heatsink ................................................23 Figure 10. Reference Heatsink Extrusion .........................................................................24 Figure 11. Reference Heatsink Clip ..................................................................................25 Figure 12. Reference Heatsink Assembly.........................................................................26 Tables Table 1. Package Loading Specifications ...........................................................................9 ® Table 2. Intel ICH8 Component Case Temperature Specifications ................................10 ® Table 3. Intel ICH8 Thermal Design Power Guidelines...................................................11 Table 6. Reference Thermal Solution Environmental Reliability Requirements ...............17 ® Table 7. Enabled Suppliers for the Intel ICH6, ICH7, and ICH8 Reference Heatsink ....19 § 4 Thermal and Mechanical Design Guidelines Revision History Rev. No. -001 • Initial Release. Description § Date June 2006 Thermal and Mechanical Design Guidelines 5 6 Thermal and Mechanical Design Guidelines Introduction 1 Introduction The objective of thermal management is to ensure that the