® Intel IXP42X Product Line Thermal Design Application Note
IXP42X Product Line: Thermal Design Application Note
This document describes the thermal characteristics for the IXP42X product line. This document is used to properly design a thermal solution for systems implementing the IXP42X product line. Properly designed solutions must provide adequate cooling to maintain the IXP42X product line case temperature (TCASE) at or below the values listed in Table 1 on page 7. Ideally, this is accomplished by providing a low local ambient temperature and creating a minimal thermal resistance to that local ambient temperature. Heat sinks may be required if case temperatures exceed those listed in Table 1. By maintaining the case temperature at or below the values recommended in this document, the IXP42X product line will function properly and reliably.
Read the full IXP42X Product Line Thermal Design Application Note.