Intel® Processor-based Communications Platform: Diagram
This block diagram provides a description of the functions, capabilities, and connectivity within the Intel® platform shown. Based on Intel® microarchitecture (formerly Ivy Bridge) and manufactured on 22-nanometer process technology, these processors are designed for single-socket systems with options for two and four cores and a thermal design power (TDP) range of 15 watts to 40 watts. When paired with the Intel® Communications Chipset 89xx Series, this platform extends the scalability of Intel® architecture into smaller footprint communications applications and intelligent systems without sacrificing standard industry features such as workload acceleration, multi-core processing, and virtualization.
INTERACTIVE BLOCK DIAGRAM
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Intel® Embedded Design Center
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Processor and chipset selection, peripheral devices, board size, power budget, and thermal analysis.
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Provides debug and validation tools, including instructional videos, for supported products on a temporary loan basis.
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